Silicon Chip (Die) 3-Point Bending Test
Strength evaluation of Si chips used on printed circuit boards is prescribed in the SEMI standard: G86-0303. Primary specifications and test jigs are as follows:
Test force measurement precision: 1% of displayed value
Test speed: 5 mm/min max.
Punch and support size: R 0.3 mm 0.02 mm
Support spacing (L)
2 mm d L and L d 20 h when the sample thickness (h) is 0.1 mm or larger
L d 2 mm and L d 50 H when the sample thickness (h) is less than 0.1 mm