LabSolutions TA Software for Thermal Analyzers
A variety of optional software programs is available for LabSolutions TA to expand the range of applications.
Temperature-Modulated DSC Program
Temperature-modulated DSC measurements achieve both high resolution and high sensitivity, enabling higher accuracy measurements. Using temperature-modulated DSC measurements, complex analyses such as separation of overlapping transitions and reactions can be performed. Speciﬁc heat measurements can also be performed, reducing the number of measurement cycles and making the process easier than standard DSC measurements, and can be obtained under pseudo isothermal conditions.
Partial Area Analysis Program
This software calculates partial fusion rates at various temperatures for use as a quality control index.
Purity Analysis Program
Sample purity is obtained quickly and easily using the purity analysis program. The software accurately calculates the purity of trace samples without sample pretreatment and materials that degrade during fusion.
Applications include analysis of pharmaceuticals, industrial chemicals, and reagents.
Dynamic Temperature Control Program
The software controls the temperature ramp rate depending on the change in TG weight signal or the TMA displacement signal.
It is used to improve the resolution with multistage changes in TG, and to optimize sintering conditions for ceramic materials in TMA.
Speciﬁc Heat Analysis Program
A comparison of the caloriﬁc values of three measurement results (a blank, a standard, and the sample) is used to perform specific heat calculations. With this program, these calculations are automated. The program allows specific heat determination of up to 15 temperatures simultaneously.
Stress-Strain Analysis Program
Stress-strain curves are easily obtained in the program by using TMA data (time/temperature, displacement and load). The software enables the user to calculate Young's modulus and averaged Young's modulus for ﬁlms and ﬁbers and allows up to 12 analyzed stress-strain curve data sets to be overlaid.
TGA Reaction Rate Analysis Program
Using the Ozawa method, the software calculates the reaction rate of a material from decomposition data obtained by TGA. The activation energy, frequency factor and other reaction rate parameters are determined using this program. It is used for estimations of reaction mechanisms, evaluation of the thermostability of materials, and estimations of a material’s operating life.
Applications include analysis of high molecular weight materials, electrical insulation materials, thermally stable polymers, composite materials, and pharmaceuticals.
DSC Reaction Rate Analysis Program
The rate of reaction is determined from DSC data at various heating rates using the Ozawa method. It is applicable to reactions, such as the curing of epoxy resins, without changes in weight. An Ozawa plot is generated whereby the activation energy, frequency factor, and other reaction rate parameters are obtained. The ﬁgure shows a reaction rate analysis of the curing reaction for an epoxy resin. The relationship between the curing temperature, curing time, and degree of curing are simulated based on the parameters obtained.
*Note: Analysis can also be performed for the DTA signal, but the photometric accuracy is not guaranteed.