Analysis of Micro Ag Particles of Lead-Free Solder

In the electronics industry of recent years, solder joining technology has become increasingly important due to the miniaturization of electronic components and popularization of lead-free (Pb-free) solder. This article introduces the high resolution X-ray images which are possible only with FEEPMA ™ and the difference in the distribution of microparticles when the accelerating voltage is changed based on an example in which a solder joint on a printed circuit board implemented with a lead-free solder (Sn-3.0Ag-0.5Cu) was analyzed using an EPMA-8050G EPMA electron probe microanalyzer.

Content Type:
Application News
Document Number:
P109
Product Type:
Universal / Tensile Testing
Keywords:
Materials/Automotive, Electronics/Semiconductors, Electron Probe Microanalyzer
Language:
English
File Name:
Analysis-of-Micro-Ag-Particles-of-Lead-Free-Solder.pdf
File Size:
2,205kb

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For Research Use Only. Not for use in diagnostic procedures.

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