inspeXio™ 7000 - Applications

Microfocus X-Ray CT System

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Aluminum Die Castings

Aluminum Die Castings MPR Image
MPR Image
Aluminum Die Castings VR Image
VR Image
Aluminum Die Castings 3D Measurement
3D Measurement
Aluminum Die Castings Defect Analysis
Defect Analysis
Aluminum Die Castings Defect Analysis Histogram

Defect Analysis Histogram

Defect analysis identifies voids and displays a color-coded map of the voids based on their volume. It can also display a frequency histogram of scale the void volume and count.

Aluminum Die Castings MPR Image FOV = ø161.5 mm
MPR Image FOV = ø161.5 mm
Aluminum Die Castings Defect Analysis
Defect Analysis
 

By scanning the die cast part before machining and then specifying the surface after machining (CAD data), the software can determine which voids are removed by machining, which remain internally, and which are exposed on the surface after machining.

Voids that are removed
Internal voids
Voids exposed on the surface

Aluminum Die Castings 3D CAD
3D CAD
Aluminum Die Castings Void Determination Based on Specifying Defect Cross Section and SurfaceBlue line: CAD data analysis after machining
Void Determination Based on Specifying Defect Cross Section and Surface
Blue line: CAD data analysis after machining

GFRP (Glass Fiber Reinforced Plastic)

Glass Fiber Reinforced Plastic (GFRP) Cross Sectional Image FOV = ø20 mm
Cross Sectional Image FOV = ø20 mm
Glass Fiber Reinforced Plastic (GFRP) Cross Sectional Image (enlarged view)
Cross Sectional Image (enlarged view)
Glass Fiber Reinforced Plastic (GFRP) Cross Sectional Image (enlarged view)
Cross Sectional Image (enlarged view)
Glass Fiber Reinforced Plastic (GFRP) VR Image
VR Image
Glass Fiber Reinforced Plastic (GFRP) Defect Analysis
Defect Analysis
Glass Fiber Reinforced Plastic (GFRP) Defect Analysis Histogram
Defect Analysis Histogram
Glass Fiber Reinforced Plastic (GFRP)
Glass Fiber Reinforced Plastic (GFRP) Fiber Orientation Analysis
Fiber Orientation Analysis
Glass Fiber Reinforced Plastic (GFRP) Fiber orientation analysis can display a color-coded map of filler orientation. Needles can also be displayed based on the orientation.
Fiber orientation analysis can display a color-coded map of filler orientation. Needles can also be displayed based on the orientation.

CFRTP (Continuous Fiber Reinforced Thermoplastic Laminate)

Continuous Fiber Reinforced Thermoplastic Laminate (CFRTP) MPR Image FOV = ø3.9 mm
MPR Image FOV = ø3.9 mm
Continuous Fiber Reinforced Thermoplastic Laminate (CFRTP) Oblique Image
Oblique Image
Continuous Fiber Reinforced Thermoplastic Laminate (CFRTP) Defect Analysis
Defect Analysis
Continuous Fiber Reinforced Thermoplastic Laminate (CFRTP) VR Image
VR Image
Continuous Fiber Reinforced Thermoplastic Laminate (CFRTP) Fiber Orientation Analysis
Fiber Orientation Analysis

BGA (Ball Grid Array)

Ball Grid Array (BGA) MPR Image FOV = ø5 mm
MPR Image FOV = ø5 mm
Ball Grid Array (BGA) VR Image
VR Image

Concrete

Concrete MPR Image FOV = ø42 mm
MPR Image FOV = ø42 mm
Concrete VR Image
VR Image
Concrete Provided by Emeritus Professor Moriyoshi at Hokkaido University
Provided by Emeritus Professor Moriyoshi at Hokkaido University

Lithium-Ion Rechargeable Battery

Lithium-Ion Rechargeable Battery Cross Sectional Image FOV = ø18.4 mm
Cross Sectional Image FOV = ø18.4 mm
Lithium-Ion Rechargeable Battery Oblique Image
Oblique Image
Lithium-Ion Rechargeable Battery VR Image
VR Image

Rectangular Lithium Polymer Battery (for Smartphones)

Rectangular Lithium Polymer Battery (for Smartphones)

Circuit Board

Circuit Board MPR Image FOV = ø 4.4 mm
MPR Image FOV = ø 4.4 mm
Circuit Board VR Image
VR Image

Mouse Fetus

Mouse Fetus MPR Image FOV = ø 13.7 mm
MPR Image FOV = ø 13.7 mm
Mouse Fetus VR Image
VR Image

Analysis Using PointMaster Reverse Engineering Software

The software can align CT data with 3D-CAD data, calculate the distance between the boundary surface defined in the CT data and the corresponding 3D-CAD data, and display a color-coded map based on such differences.

 

Analysis Using PointMaster Reverse Engineering Software

For inquiries about the absorbed dose to samples such as semiconductors, please contact here.