inspeXio™ 7000 - Applications
Microfocus X-Ray CT System
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Aluminum Die Castings
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GFRP (Glass Fiber Reinforced Plastic)
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CFRTP (Continuous Fiber Reinforced Thermoplastic Laminate)
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BGA (Ball Grid Array)
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Concrete
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Lithium-Ion Rechargeable Battery
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Rectangular Lithium Polymer Battery (for Smartphones)
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Circuit Board
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Mouse Fetus
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Analysis Using PointMaster Reverse Engineering Software
Aluminum Die Castings
Defect Analysis Histogram
Defect analysis identifies voids and displays a color-coded map of the voids based on their volume. It can also display a frequency histogram of scale the void volume and count.
By scanning the die cast part before machining and then specifying the surface after machining (CAD data), the software can determine which voids are removed by machining, which remain internally, and which are exposed on the surface after machining.
● Voids that are removed
● Internal voids
● Voids exposed on the surface
Blue line: CAD data analysis after machining
GFRP (Glass Fiber Reinforced Plastic)
CFRTP (Continuous Fiber Reinforced Thermoplastic Laminate)
BGA (Ball Grid Array)
Concrete
Lithium-Ion Rechargeable Battery
Rectangular Lithium Polymer Battery (for Smartphones)
Circuit Board
Mouse Fetus
Analysis Using PointMaster Reverse Engineering Software
The software can align CT data with 3D-CAD data, calculate the distance between the boundary surface defined in the CT data and the corresponding 3D-CAD data, and display a color-coded map based on such differences.

For inquiries about the absorbed dose to samples such as semiconductors, please contact here.